TSMC is reportedly considering building advanced packaging capacity in Japan
云海听松
发表于 2024-3-18 09:34:11
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On March 18th, sources reported that TSMC is considering building advanced packaging capacity in Japan, and discussions are still in the early stages. Sources say that TSMC is considering introducing its CoWoS packaging technology to Japan as a solution. (Reuters)
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Disclaimer: The views expressed in this article are those of the author only, this article does not represent the position of CandyLake.com, and does not constitute advice, please treat with caution.
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