According to industry sources, TSMC has recently completed the integration of CPO and advanced packaging technology, and is expected to send samples next year. Its key CPO technology, micro ring light modulator (MRM), developed in collaboration with Broadcom, has been successfully trial produced in a 3nm process, indicating that CPO will have the opportunity to integrate with AI chips such as high-performance computing (HPC) or ASIC in the future. Industry analysis shows that TSMC's current technology concept in the field of silicon photonics is mainly to integrate CPO modules with advanced packaging technologies such as CoWoS or SoIC, so that transmission signals are no longer limited by the speed of traditional copper lines. It is estimated that TSMC will enter the sample delivery process next year, and 1.6T products will enter mass production as early as the second half of 2025 and be fully shipped in 2026.