TSMC considers raising prices for 3nm process and CoWoS advanced packaging
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发表于 2024-11-4 11:12:21
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According to Morgan Stanley's latest report, TSMC is considering raising prices for its 3nm process and CoWoS advanced packaging technology to cope with the surge in market demand. TSMC plans to implement price increases in 2025, with prices for 3nm processes expected to rise by up to 5%, while CoWoS packaging prices may increase by 10% to 20%.
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Disclaimer: The views expressed in this article are those of the author only, this article does not represent the position of CandyLake.com, and does not constitute advice, please treat with caution.
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