TSMC is considering building advanced chip packaging capacity in Japan
海角七号
发表于 2024-3-18 09:21:07
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TSMC is considering building advanced chip packaging capacity in Japan, and one option is to introduce its CoWoS packaging technology to Japan.
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Disclaimer: The views expressed in this article are those of the author only, this article does not represent the position of CandyLake.com, and does not constitute advice, please treat with caution.
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