AI demands increasingly high computing power. TSMC is reportedly developing new advanced chip packaging technology
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发表于 2024-6-20 19:20:19
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According to sources cited by media, TSMC is developing a new advanced chip packaging technology aimed at meeting the computing power requirements of future artificial intelligence (AI). According to insiders, TSMC is collaborating with equipment and material suppliers to develop this new technology, which may take several years to commercialize.
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Disclaimer: The views expressed in this article are those of the author only, this article does not represent the position of CandyLake.com, and does not constitute advice, please treat with caution.
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