TSMC is reportedly exploring new chip packaging technologies
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发表于 2024-6-20 14:01:49
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On June 20th, it was reported that TSMC is exploring new chip packaging technologies. Several insiders have stated that TSMC is collaborating with equipment and material suppliers to develop this new method, but commercialization may take several years. (Nikkei News)
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Disclaimer: The views expressed in this article are those of the author only, this article does not represent the position of CandyLake.com, and does not constitute advice, please treat with caution.
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