첫 페이지 News 본문

Recently, NVIDIA announced its "strongest AI chip on the surface" H200, which requires two key technologies to support its title: CoWoS high-end packaging led by TSMC and HBM (High Bandwidth Storage), which continues to be iterated by leading storage factories.
CandyLake.com is an information publishing platform and only provides information storage space services.
Disclaimer: The views expressed in this article are those of the author only, this article does not represent the position of CandyLake.com, and does not constitute advice, please treat with caution.
您需要登录后才可以回帖 登录 | Sign Up

本版积分规则

王俊杰2017 注册会员
  • Follow

    0

  • Following

    0

  • Articles

    28