Intel announces expansion of Chengdu packaging and testing base to improve local supply chain efficiency in China
因醉鞭名马幌
发表于 2024-10-28 13:25:32
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Chengdu, October 28 (Xinhua) -- Intel Corporation announced on the 28th that it will expand its packaging and testing base located in Chengdu High tech Zone, increase its registered capital of 300 million US dollars for Intel Products (Chengdu) Co., Ltd., add server chip packaging and testing facilities on the basis of existing client product packaging and testing, and establish a customer solution center to improve the efficiency of the local supply chain and increase support for Chinese customers.
It is understood that the newly added production capacity of the project will focus on providing packaging and testing services for server chips, in response to the demand of Chinese customers for high energy efficiency and customized packaging solutions; The upcoming Intel Customer Solutions Center will become a one-stop platform for driving enterprise digital transformation, working together with customers and ecosystem partners to provide customized solutions based on Intel architecture and products for industry customers, accelerating the implementation of industry applications.
Wang Rui, Senior Vice President of Intel Corporation and Chairman of Intel China, stated that China's continuous high-quality development and high-level opening-up are the foundation and driving force for Intel's long-term development in the Chinese market. Intel's strategy of rooting in China and serving customers remains unchanged. The expansion of the Chengdu base will enable Intel to focus more on local needs, integrate resources, respond more quickly to the digital and green transformation of Chinese customers, and inject new momentum into the sustainable development of the digital economy.
Wang Rui pointed out that Intel has been deeply involved in the construction of the local ecosystem and community in Chengdu for more than 20 years. "We look forward to the expansion of the Chengdu base becoming a new milestone for Intel to deepen cooperation with the industry
It is reported that as the main battlefield for the development of Chengdu's electronic information industry, Chengdu High tech Zone has formed advantageous clusters of new displays, intelligent terminals and other electronic information industries, gathering a large number of internationally and domestically renowned enterprises such as Foxconn, Siemens, Intel, Texas Instruments, Huawei, BOE, etc., forming a full industry chain ecological park from IC design, wafer manufacturing, packaging and testing to equipment materials. (End)
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Disclaimer: The views expressed in this article are those of the author only, this article does not represent the position of CandyLake.com, and does not constitute advice, please treat with caution.
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